Process Equipment Penang

Integrated Wafer Inspection Microscopy System is designed for high-resolution optical inspection and dimensional review. It gives process engineers investigating surfaces, patterns and critical features a practical way to strengthen process consistency, improve traceability and support safer day-to-day operation.

Automated Wafer Metrology Inspection System is designed for automated inspection and measurement for wafer process monitoring. It gives semiconductor teams improving defect visibility and measurement consistency a practical way to strengthen process consistency, improve traceability and support safer day-to-day operation.

Precision Package Sawing Machine is designed for stable precision sawing for electronic packages and technical specimens. It gives production and laboratory users requiring clean, repeatable cuts a practical way to strengthen process consistency, improve traceability and support safer day-to-day operation.

Laser Decapsulation System is designed for targeted package opening to support semiconductor failure analysis. It gives analysis teams needing controlled access to internal device structures a practical way to strengthen process consistency, improve traceability and support safer day-to-day operation.

Automatic Thin Section Cutter is designed for automated precision sectioning for repeatable sample preparation. It gives laboratories that need efficient cutting with consistent operator results a practical way to strengthen process consistency, improve traceability and support safer day-to-day operation.

Precision Wafer Sample Cutting System is designed for controlled sample cutting for laboratory and failure-analysis preparation. It gives engineers preparing accurate specimens while limiting handling damage a practical way to strengthen process consistency, improve traceability and support safer day-to-day operation.

Wafer Backside Laser Marking System is designed for traceable laser identification on wafer backsides. It gives manufacturers improving identification, genealogy and downstream process control a practical way to strengthen process consistency, improve traceability and support safer day-to-day operation.

High-Precision Double-Sided Mask Aligner is designed for accurate double-sided lithography alignment for advanced fabrication work. It gives research, MEMS and semiconductor teams requiring dependable overlay control a practical way to strengthen process consistency, improve traceability and support safer day-to-day operation.

High-Speed Jigsaw Dicing Machine is designed for high-throughput singulation with integrated material handling. It gives semiconductor packaging lines balancing productivity with process control a practical way to strengthen process consistency, improve traceability and support safer day-to-day operation.

Automatic Wafer Dicing Machine is designed for precision wafer separation for controlled semiconductor processing. It gives fabs and assembly operations that require repeatable dicing performance a practical way to strengthen process consistency, improve traceability and support safer day-to-day operation.

Autoloader Inspection Station is designed for automated loading, positioning and inspection of semiconductor materials. It gives production teams seeking consistent handling and reduced manual intervention a practical way to strengthen process consistency, improve traceability and support safer day-to-day operation.